BMIT specializes in designing of complex multilayer printed circuit boards (PCBs). We are fundamentally strong in signal integrity, crosstalk, EMI-EMC and thermal management. We are traditionally good in the layer stack selection, power and ground planning, differential and single ended signal routing, terminations, decoupling, impedance matching, controlled impedance, delay matching and optimum placement. We have designed boards using latest high pin count and fine pitch BGAs and connectors. We have also developed PCB’s using latest technologies like Rigid Flex, Micro vias and Rogers.